Datasheet

ADG1611/ADG1612/ADG1613 Data Sheet
Rev. B | Page 16 of 16
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 34. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT
TO
JEDEC STANDARDS MO-220-VGGC.
1
0.65
BSC
0.60 MAX
P
I
N
1
I
N
D
I
C
A
T
O
R
1.95 BCS
0.50
0.40
0.30
0.25 MIN
3.75
BSC SQ
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDI
C
ATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
4.00
BSC SQ
2.65
2.50 SQ
2.35
16
5
13
8
9
12
4
EXPOSED
PA D
BOTTOM VIEW
031006-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 35. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-16-13)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG1611BRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1611BRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1611BRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1611BCPZ-REEL −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1611BCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1612BRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1612BRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1612BRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1612BCPZ- REEL −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1612BCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1613BRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1613BRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1613BRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1613BCPZ-REEL −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1613BCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
1
Z = RoHS Compliant Part.
©2009-2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07981-0-3/12(B)