Datasheet

ADG1608/ADG1609
Rev. 0 | Page 18 of 20
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 36. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
3.10
3.00 SQ
2.90
0.30
0.23
0.18
1.75
1.60 SQ
1.55
070209-C
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
0.50
0.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.80
0.75
0.70
COMPLIANT TO JEDEC STANDARDS MO-220-WEED.
Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm x 3 mm Body, Very Very Thin Quad
(CP-16-22)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description
Package
Option
Branding
ADG1608BRUZ
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1608BRUZ-REEL7
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1608BCPZ-REEL7
1
−40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-22 S38
ADG1609BRUZ
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1609BRUZ-REEL7
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1609BCPZ-REEL7
1
−40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-22 S39
1
Z = RoHS Compliant Part.