Datasheet

ADG1606/ADG1607
Rev. 0 | Page 8 of 24
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
T
A
= 25°C, unless otherwise noted.
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7.
Parameter Rating
V
DD
to V
SS
18 V
V
DD
to GND −0.3 V to +18 V
V
SS
to GND +0.3 V to −18 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Digital Inputs
2
GND − 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D
1.1 A (pulsed at 1 ms,
10% duty cycle maximum)
Continuous Current, S or D
3
Data + 15%
Operating Temperature Range
Industrial (B Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Reflow Soldering Peak
Temperature, Pb Free
260°C
Table 8. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
28-Lead TSSOP 97.9 14 °C/W
32-Lead LFCSP_VQ 46 °C/W
ESD CAUTION
1
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
2
Overvoltages at the Ax, EN, Sx, or Dx pins are clamped by internal diodes.
Current should be limited to the maximum ratings given.
3
See Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.