Datasheet

ADG1606/ADG1607 Data Sheet
Rev. A | Page 8 of 22
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 7.
Parameter Rating
V
DD
to V
SS
18 V
V
DD
to GND −0.3 V to +18 V
V
SS
to GND +0.3 V to −18 V
Analog Inputs
1
V
SS
0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Digital Inputs
2
GND − 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D 1.1 A (pulsed at 1 ms,
10% duty cycle maximum)
Continuous Current, S or D
3
Data + 15%
Operating Temperature Range
Industrial (B Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Reflow Soldering Peak
Temperature, Pb Free
260°C
1
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
2
Overvoltages at the Ax, EN, Sx, or Dx pins are clamped by internal diodes.
Current should be limited to the maximum ratings given.
3
See Table 5.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Only one absolute maximum rating may be applied at any
one time.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
28-Lead TSSOP 97.9 14 °C/W
32-Lead LFCSP
46
°C/W
ESD CAUTION
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