Datasheet

ADG1438/ADG1439
Rev. A | Page 20 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
COPLANARIT
Y
0.10
Figure 37. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
2.65
2.50 SQ
2.35
3.75
BSC SQ
4.00
BSC SQ
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-1
090408-B
1
0.50
BSC
P
I
N
1
I
N
D
I
C
A
T
O
R
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDI
C
ATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
20
6
16
10
11
15
5
EXPOSED
PAD
(BOTTOM VIEW)
0.60 MAX
0.60 MAX
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 38. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG1438BRUZ −40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG1438BRUZ-REEL7 −40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG1438BCPZ-REEL7 −40°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-20-4
ADG1439BRUZ −40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG1439BRUZ-REEL7 −40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG1439BCPZ-REEL7 −40°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-4
1
Z = RoHS Compliant Part.
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D08496-0-5/10(A)