Datasheet

ADG1438/ADG1439
Rev. A | Page 10 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 8.
Parameter Rating
V
DD
to V
SS
35 V
V
DD
to GND −0.3 V to +25 V
V
SS
to GND +0.3 V to −25 V
V
L
to GND −0.3 V to +7 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Digital Inputs
1
GND − 0.3 V to V
L
+ 0.3 V or
30 mA, whichever occurs first
Continuous Current, Sx or
Dx Pins
Table 5 and Table 6 specifica-
tions + 15%
Peak Current, Sx or Dx Pins
(Pulsed at 1 ms, 10% Duty
Cycle Max)
TSSOP 300 mA
LFCSP 400 mA
Operating Temperature Range
Industrial (B Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Reflow Soldering Peak
Temperature (Pb-Free)
260(+0/−5)°C
Time at Peak Temperature 10 sec to 40 sec
1
Overvoltages at the analog and digital inputs are clamped by internal
diodes. Current should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Table 9. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
20 Lead TSSOP (4-Layer Board) 112.6 50 °C/W
20-Lead LFCSP (4-Layer Board and
Exposed Paddle Soldered to V
SS
)
30.4 N/A °C/W
ESD CAUTION