Datasheet

ADG1433/ADG1434
Rev. C | Page 17 of 20
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
COPLANARIT
Y
0.10
Figure 38. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
2.65
2.50 SQ
2.35
3.75
BSC SQ
4.00
BSC SQ
1
0.50
BSC
P
I
N
1
I
N
D
I
C
A
T
O
R
0.50
0.40
0.30
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-1
090408-B
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDI
C
ATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
20
6
16
10
11
15
5
EXPOSED
PAD
(BOTTOM VIEW)
0.60 MAX
0.60 MAX
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Description
EN
Pin
Package Option
ADG1433YRUZ
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] Yes RU-16
ADG1433YRUZ-REEL
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] Yes RU-16
ADG1433YRUZ-REEL7
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] Yes RU-16
ADG1433YCPZ-REEL
1
−40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Yes CP-16-13
ADG1433YCPZ-REEL7
1
−40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Yes CP-16-13
ADG1434YRUZ
1
−40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] No RU-20
ADG1434YRUZ-REEL
1
−40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] No RU-20
ADG1434YRUZ-REEL7
1
−40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] No RU-20
ADG1434YCPZ-REEL
1
−40°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Yes CP-20-4
ADG1434YCPZ-REEL7
1
−40°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Yes CP-20-4
1
Z = RoHS Compliant Part.