Datasheet

ADG1433/ADG1434
Rev. C | Page 16 of 20
OUTLINE DIMENSIONS
16
9
81
4.50
4.40
4.30
PIN 1
SEATING
PLANE
8°
0°
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.
Figure 36. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
1
0.65
BSC
0.60 MAX
P
I
N
1
I
N
D
I
C
A
T
O
R
1.95 BCS
0.50
0.40
0.30
0.25 MIN
3.75
BSC SQ
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDI
C
ATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
4.00
BSC SQ
2.65
2.50 SQ
2.35
16
5
13
8
9
12
4
EXPOSED
PA D
BOTTOM VIEW
031006-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-13)
Dimensions shown in millimeters