Datasheet

ADG1433/ADG1434
Rev. C | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter Rating
V
DD
to V
SS
35 V
V
DD
to GND −0.3 V to +25 V
V
SS
to GND −25 V to +0.3 V
Analog Inputs, Digital Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D (Pulsed at 1 ms,
10% Duty Cycle Maximum)
250 mA
Continuous Current, S or D
2
Data + 15%
Operating Temperature Range
Industrial (Y Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Reflow Soldering Peak
Temperature (Pb-Free)
260 (+ 0 to −5)°C
1
Overvoltages at A,
EN
, S, or D pins are clamped by internal diodes. Current
should be limited to the maximum ratings given.
2
See data given in the Specifications section (see Table 1 to Table 3).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5.
Package Type θ
JA
θ
JC
Unit
TSSOP 150.4 50 °C/W
LFCSP_VQ 30.4 N/A °C/W
ESD CAUTION