Datasheet

ADG1421/ADG1422/ADG1423
Rev. 0 | Page 15 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-187-BA
091709-A
6°
0°
0.70
0.55
0.40
5
10
1
6
0.50 BSC
0.30
0.15
1.10 MAX
3.10
3.00
2.90
COPLANARITY
0.10
0.23
0.13
3.10
3.00
2.90
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 33. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
031208-B
TOP VIEW
10
1
6
5
0.30
0.23
0.18
*
EXPOSED
PAD
(BOTTOM VIEW)
PIN 1 INDEX
AREA
3.00
BSC SQ
SEATING
PLANE
0.80
0.75
0.70
0.20 REF
0.05 MAX
0.02 NOM
0.80 MAX
0.55 NOM
1.74
1.64
1.49
2.48
2.38
2.23
0.50
0.40
0.30
0.50 BSC
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
2
0
)
*
FOR PROPER CONNECTION OF THE EXPOSED PAD PLEASE REFER TO
THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION
OF THIS DATA SHEET.
Figure 34. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
ADG1421BRMZ
1
−40°C to +125°C 10-Lead Mini Small Outline Package [MSOP] RM-10 S2V
ADG1421BRMZ-REEL7
1
−40°C to +125°C 10-Lead Mini Small Outline Package [MSOP] RM-10 S2V
ADG1421BCPZ-REEL7
1
−40°C to +125°C 10- Lead Frame Chip Scale Package [LFCSP_WD] CP-10-9 S2V
ADG1422BRMZ
1
−40°C to +125°C 10-Lead Mini Small Outline Package [MSOP] RM-10 S2W
ADG1422BRMZ-REEL7
1
−40°C to +125°C 10-Lead Mini Small Outline Package [MSOP] RM-10 S2W
ADG1422BCPZ-REEL7
1
−40°C to +125°C 10- Lead Frame Chip Scale Package [LFCSP_WD] CP-10-9 S2W
ADG1423BRMZ
1
−40°C to +125°C 10-Lead Mini Small Outline Package [MSOP] RM-10 S2X
ADG1423BRMZ-REEL7
1
−40°C to +125°C 10-Lead Mini Small Outline Package [MSOP] RM-10 S2X
ADG1423BCPZ-REEL7
1
−40°C to +125°C 10- Lead Frame Chip Scale Package [LFCSP_WD] CP-10-9 S2X
1
Z = RoHS Compliant Part.