Datasheet

Data Sheet ADG1433/ADG1434
Rev. E | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter Rating
V
DD
to V
SS
35 V
V
DD
to GND −0.3 V to +25 V
V
SS
to GND −25 V to +0.3 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA (whichever occurs first)
Digital Inputs
1
GND − 0.3 V to V
DD
+ 0.3 V or
30 mA (whichever occurs first)
Peak Current, S or D (Pulsed at 1 ms,
10% Duty Cycle Maximum)
250 mA
Continuous Current, S or D
2
Data + 15%
Operating Temperature Range
Industrial (Y Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Reflow Soldering Peak
Temperature (Pb-Free)
260 (+ 0 to −5)°C
1
Overvoltages at A,
EN
, S, or D pins are clamped by internal diodes. Current
must be limited to the maximum ratings given.
2
See data given in the Specifications section (see Table 1 to Table 3).
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Only one absolute maximum rating may be applied at any
one time.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5.
Package Type θ
JA
θ
JC
Unit
TSSOP 150.4 50 °C/W
LFCSP
30.4
N/A
1
°C/W
1
N/A means not applicable.
ESD CAUTION
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