Datasheet

Data Sheet ADG1433/ADG1434
Rev. E | Page 17 of 20
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
8°
0
°
COPLANARITY
0.10
Figure 38. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
0.
50
BSC
0.50
0.40
0.30
0.3
0
0
.25
0
.20
COMPLIANT TO JEDEC STANDARDS MO-
220
-WG
GD.
0
6
1
6
0
9
-
B
BOTTOMVIEWTOPVI
EW
EXPOSED
PAD
P
I
N
1
I
ND
I
CA
T
OR
4
.10
4
.00 S
Q
3.90
SE
ATI
NG
PLANE
0.80
0.75
0.7
0
0
.05 M
AX
0
.02 N
OM
0.20 REF
0.25 MIN
COPLANARITY
0.0
8
PIN 1
I
NDIC
ATO
R
2.65
2.50 SQ
2.35
FOR PROPER CONNECTION OF
THE EXPO
SED
PAD,
REF
ER T
O
THE PIN CONFIGURATION AND
FUNCTION D
ESCR
IPT
ION
S
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-20-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Description
EN
Pin
Package Option
ADG1433YRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] Yes RU-16
ADG1433YRUZ-REEL
−40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
Yes
RU-16
ADG1433YRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] Yes RU-16
ADG1433YCPZ-REEL −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] Yes CP-16-26
ADG1433YCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] Yes CP-16-26
ADG1434YRUZ −40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] No RU-20
ADG1434YRUZ-REEL −40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] No RU-20
ADG1434YRUZ-REEL7 −40°C to +125°C 20-Lead Thin Shrink Small Outline Package [TSSOP] No RU-20
ADG1434YCPZ-REEL −40°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP] Yes CP-20-10
ADG1434YCPZ-REEL7 −40°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP] Yes CP-20-10
1
Z = RoHS Compliant Part.
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