Datasheet

ADG1433/ADG1434 Data Sheet
Rev. E | Page 16 of 20
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 36. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT TO
JEDEC STANDAR
DS M
O-22
0-WGGC.
0
427
09-
A
1
0.65
BSC
BOT
TOM
VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
4.1
0
4
.00
SQ
3.90
0.50
0.40
0.30
SEATING
PLA
NE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
COPLA
NAR
ITY
0.08
PIN 1
IND
ICA
TOR
0.35
0
.30
0.2
5
2.
60
2.5
0 SQ
2.
40
FOR PROPER CO
NNE
CTI
ON O
F
THE EXPOSED PAD, REFER TO
THE PIN CONFIGUR
ATI
ON AN
D
FUN
CTI
ON DESCRIPTIONS
SECTION OF THIS DA
TA S
HEE
T.
Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-26)
Dimensions shown in millimeters
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