Datasheet

ADG1419
Rev. 0 | Page 15 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-187-AA
100709-B
6°
0°
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 33. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
0
81806-
A
COPLANARITY
0.08
0.50
0.40
0.30
0.20 MIN
0.05 MAX
0.02 NOM
0.15 REF
0.50
PIN 1
INDICATOR
EXPOSED
PAD
BOTTOM VIEW
TOP VIEW
0.30
0.25
0.20
0.80
0.75
0.70
SEATING
PLANE
3.00 BSC
SIDE VIEW
14
85
2.00 BSC
INDEX
AREA
1.90
1.80
1.65
1.75
1.65
1.50
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 34. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 2 mm Body, Very Very Thin, Dual Lead
(CP-8-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
ADG1419BRMZ
1
−40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S1L
ADG1419BRMZ-REEL7
1
−40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S1L
ADG1419BCPZ-REEL7
1
−40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-8-4 1C
1
Z = RoHS Compliant Part.