Datasheet

ADG1414 Data Sheet
Rev. A | Page 20 of 20
OUTLINE DIMENSIONS
24
13
121
6.40 BSC
4.50
4.40
4.30
PIN 1
7.90
7.80
7.70
0.15
0.05
0.30
0.19
0.65
BSC
1.20
MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
SEATING
PLANE
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AD
Figure 32. 24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8
04-11-2012-A
1
0.50
BSC
P
I
N
1
I
N
D
I
C
A
T
O
R
2.50 REF
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
2.65
2.50 SQ
2.35
24
7
19
12
13
18
6
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
3.75 BSC
SQ
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
Figure 33. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-24-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG1414BRUZ −40°C to +125°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
ADG1414BRUZ-REEL7 −40°C to +125°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
ADG1414BCPZ-REEL7 −40°C to +125°C 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-24-3
1
Z = RoHS Compliant Part.
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D08497-0-1/13(A)