Datasheet

ADG1414 Data Sheet
Rev. A | Page 10 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 7.
Parameter Rating
V
DD
to V
SS
35 V
V
DD
to GND −0.3 V to +25 V
V
SS
to GND +0.3 V to −25 V
V
L
to GND −0.3 V to +7 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Digital Inputs
1
GND − 0.3 V to V
L
+ 0.3 V or
30 mA, whichever occurs first
Continuous Current, Sx or Dx
Pins
Table 4 specifications + 15%
Peak Current, Sx or Dx (Pulsed
at 1 ms, 10% Duty Cycle Max)
TSSOP Package 300 mA
LFCSP Package 400 mA
Operating Temperature Range
Industrial (B Version) –40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Reflow Soldering Peak
Temperature, Pb free
260°C
Time at Peak Temperature 10 sec to 40 sec
1
Overvoltages at the analog and digital inputs are clamped by internal
diodes. Limit the current to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
THERMAL RESISTANCE
Table 8. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
24-Lead TSSOP
1
112.6 50 °C/W
24-Lead LFCSP
2
30.4 °C/W
1
4-layer board.
2
4-layer board and exposed paddle soldered to V
SS
.
ESD CAUTION