Datasheet

Data Sheet ADG1411/ADG1412/ADG1413
Rev. C | Page 15 of 16
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 33. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
042709-A
1
0.65
BSC
BOTTOMVIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.50
0.40
0.30
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
2.60
2.50 SQ
2.40
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-26)
Dimensions shown in millimeters
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