Datasheet

ADG1411/ADG1412/ADG1413
Rev. B | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter Rating
V
DD
to V
SS
35 V
V
DD
to GND −0.3 V to +25 V
V
SS
to GND +0.3 V to −25 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Digital Inputs
1
GND − 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Peak Current, Sx or Dx Pins 500 mA (pulsed at 1 ms,
10% duty cycle maximum)
Continuous Current per
Channel at 25°C
16-Lead TSSOP 190 mA
16-Lead LFCSP 250 mA
Continuous Current per
Channel at 125°C
16-Lead TSSOP 90 mA
16-Lead LFCSP 100 mA
Operating Temperature Range
Automotive (Y Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
16-Lead TSSOP, θ
JA
Thermal
Impedance (Four-Layer Board)
112°C/W
16-Lead LFCSP, θ
JA
Thermal
Impedance
30.4°C/W
Reflow Soldering Peak
Temperature, Pb Free
260(+0/−5)°C
1
Overvoltages at the INx, Sx, and Dx pins are clamped by internal diodes.
Current should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
ESD CAUTION