Datasheet

ADG1408/ADG1409
Rev. B | Page 9 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 6.
Parameter Rating
V
DD
to V
SS
35 V
V
DD
to GND −0.3 V to +25 V
V
SS
to GND +0.3 V to −25 V
Analog Inputs, Digital Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V
or 30 mA, whichever
occurs first
Continuous Current, S or D Table 5 data + 10%
Peak Current, S or D (Pulsed at 1 ms,
10% Duty Cycle Maximum)
350 mA
Operating Temperature Range
Industrial (Y Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Reflow Soldering Peak Temperature
(Pb-Free)
260(+0/−5)°C
1
Overvoltages at A, EN, S, or D are clamped by internal diodes. Current should
be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any
one time.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
16-Lead TSSOP 150.4 50 °C/W
16-Lead LFCSP 30.4 °C/W
ESD CAUTION