Datasheet

ADG1408/ADG1409
Rev. B | Page 10 of 20
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
EN
V
SS
S1
S4
S3
S2
A0
A2
GND
V
DD
S7
DS
S6
S5
A1
ADG1408
TOP VIEW
(Not to Scale)
8
0
4861-002
Figure 2. ADG1408 Pin Configuration (TSSOP)
PIN 1
INDICATOR
1V
SS
NOTES
1. THE EXPOSED PAD IS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, V
SS
.
2S1
3S2
4S3
11 V
DD
12 GND
10 S5
9S6
5
S4
6
D
7
S8
8
S7
15
A0
16
EN
14
A1
13
A2
TOP VIEW
(Not to Scale)
ADG1408
04861-003
Figure 3. ADG1408 Pin Configuration (LFCSP)
Table 8. ADG1408 Pin Function Descriptions
Pin No.
TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input.
2 16 EN
Active High Digital Input. When low, the device is disabled and all switches are off. When high,
Ax logic inputs determine on switches.
3 1 V
SS
Most Negative Power Supply Potential. In single supply applications, it can be connected
to ground.
4 2 S1 Source Terminal 1. Can be an input or an output.
5 3 S2 Source Terminal 2. Can be an input or an output.
6 4 S3 Source Terminal 3. Can be an input or an output.
7 5 S4 Source Terminal 4. Can be an input or an output.
8 6 D Drain Terminal. Can be an input or an output.
9 7 S8 Source Terminal 8. Can be an input or an output.
10 8 S7 Source Terminal 7. Can be an input or an output.
11 9 S6 Source Terminal 6. Can be an input or an output.
12 10 S5 Source Terminal 5. Can be an input or an output.
13 11 V
DD
Most Positive Power Supply Potential.
14 12 GND Ground (0 V) Reference.
15 13 A2 Logic Control Input.
16 14 A1 Logic Control Input.
EP Exposed Pad
The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, V
SS
.
Table 9. ADG1408 Truth Table
A2 A1 A0 EN On Switch
X X X 0 None
0 0 0 1 1
0 0 1 1 2
0 1 0 1 3
0 1 1 1 4
1 0 0 1 5
1 0 1 1 6
1 1 0 1 7
1 1 1 1 8