Datasheet
ADG1406/ADG1407
Rev. A | Page 8 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 7.
Parameter Rating
V
DD
to V
SS
35 V
V
DD
to GND −0.3 V to +25 V
V
SS
to GND +0.3 V to −25 V
Analog, Digital Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V
or 30 mA, whichever
occurs first
Continuous Current, Sx or Dx Pins
Table 5 and Table 6
specifications + 15%
Peak Current, Sx or Dx Pins (Pulsed
at 1 ms, 10% Duty Cycle
Maximum)
28-Lead TSSOP 300 mA
32-Lead LFCSP_VQ 550 mA
Operating Temperature Range
Industrial (B Version) –40°C to +125°C
Storage Temperature Range –65°C to +150°C
Junction Temperature 150°C
Reflow Soldering, Pb-Free
Peak Temperature 260 (+0/−5)°C
Time at Peak Temperature 10 sec to 40 sec
1
Overvoltages at the Ax, EN, Sx, or Dx pins are clamped by internal diodes.
Limit current to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
28-Lead TSSOP 97.9 14 °C/W
32-Lead LFCSP_VQ 27.27 °C/W
ESD CAUTION