Datasheet

ADG1406/ADG1407
Rev. A | Page 20 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
141
8°
0°
SEATING
PLANE
C
OPLANARIT
Y
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 38. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
011708-A
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDI
C
ATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 39. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Description Package Option
ADG1406BRUZ
1
−40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1406BRUZ-REEL7
1
−40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1406BCPZ-REEL7
1
−40°C to +125°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2
ADG1407BRUZ
1
−40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1407BRUZ-REEL7
1
−40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1407BCPZ-REEL7
1
−40°C to +125°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2
1
Z = RoHS Compliant Part.
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D07419-0-3/09(A)