Datasheet

ADG1236
Rev. 0 | Page 14 of 16
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AB
Figure 30. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
*
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
EXCEPT FOR EXPOSED PAD DIMENSION.
1
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
0.75
0.55
0.35
0.25 MIN
0.45
TOP
VIEW
12 MAX
0.80 MAX
0.65 TYP
PIN 1
INDICATO
R
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
*
1.45
1.30 SQ
1.15
12
4
10
6
7
9
3
2.75
BSC SQ
3.00
BSC SQ
2
5
8
11
COPLANARITY
0.08
EXPOSED PAD
(BOTTOM VIEW)
SEATING
PLANE
Figure 31. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-12-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG1236YRUZ
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1236YRUZ-REEL
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1236YRUZ-REEL7
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1236YCPZ-500RL7
1
−40°C to +125°C 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-12-1
ADG1236YCPZ-REEL7
1
−40°C to +125°C 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-12-1
1
Z = Pb-free part.