Datasheet

ADG1204
Rev. B | Page 15 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 32. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
*
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
EXCEPT FOR EXPOSED PAD DIMENSION.
*
1.45
1.30 SQ
1.15
050808-B
1
0.50
BSC
0.75
0.60
0.50
0.25 MIN
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
12
4
10
6
7
9
3
COPLANARITY
0.08
EXPOSED
PAD
(BOTTOM
VIEW)
S
EATING
PLANE
3.15
3.00 SQ
2.85
2.95
2.75 SQ
2.55
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
Figure 33. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-12-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG1204YRUZ
1
−40°C to +125°C 14-Lead Thin Shrink Small Outline Package (TSSOP) RU-14
ADG1204YRUZ-REEL
1
−40°C to +125°C 14-Lead Thin Shrink Small Outline Package (TSSOP) RU-14
ADG1204YRUZ-REEL7
1
−40°C to +125°C 14-Lead Thin Shrink Small Outline Package (TSSOP) RU-14
ADG1204YCPZ-500RL7
1
−40°C to +125°C 12-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-12-1
ADG1204YCPZ-REEL7
1
−40°C to +125°C 12-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-12-1
1
Z = RoHS Compliant Part..