Datasheet

ADF4360-9 Data Sheet
Rev. C | Page 24 of 24
OUTLINE DIMENSIONS
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-2
04-09-2012-A
1
0.50
BSC
PIN 1
INDICATOR
2.50 REF
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
2.45
2.30 SQ
2.15
24
7
19
12
13
18
6
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
3.75 BSC
SQ
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
Figure 36. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Frequency Range Package Option
ADF4360-9BCPZ −40°C to +85°C 24-Lead LFCSP_VQ 65 MHz to 400 MHz CP-24-2
ADF4360-9BCPZRL −40°C to +85°C 24-Lead LFCSP_VQ 65 MHz to 400 MHz CP-24-2
ADF4360-9BCPZRL7 −40°C to +85°C 24-Lead LFCSP_VQ 65 MHz to 400 MHz CP-24-2
EV-ADF4360-9EB1Z Evaluation Board
1
Z = RoHS Compliant Part.
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D07139-0-11/12(C)