Datasheet

ADF4351 Data Sheet
Rev. 0 | Page 28 of 28
OUTLINE DIMENSIONS
3.25
3.10 SQ
2.95
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
1
32
8
9
25
24
17
16
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
0.60 MAX
0.60 MAX
0.25 MIN
03-28-2012-A
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
Figure 40. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADF4351BCPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2
ADF4351BCPZ-RL7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2
EVAL-ADF4351EB1Z Evaluation Board
1
Z = RoHS Compliant Part.
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D09800-0-5/12(0)