Datasheet

ADF4350
Rev. A | Page 29 of 32
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
011708-A
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 40. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADF4350BCPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2
ADF4350BCPZ-RL −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2
ADF4350BCPZ-RL7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2
EVAL-ADF4350EB1Z Evaluation Board, Primary RF Output Available
EVAL-ADF4350EB2Z Evaluation Board, Primary and Auxiliary RF Outputs Available
1
Z = RoHS Compliant Part.