Datasheet

Data Sheet ADF4159
Rev. D | Page 7 of 36
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, GND = AGND = DGND = SDGND = CPGND =
0 V, unless otherwise noted.
Table 4.
Parameter Rating
AV
DD
to GND
−0.3 V to +3.9 V
DV
DD
to GND −0.3 V to +2.4 V
V
P
to GND −0.3 V to +3.9 V
V
P
to AV
DD
−0.3 V to +0.3 V
Digital I/O Voltage to GND −0.3 V to DV
DD
+ 0.3 V
Analog I/O Voltage to GND −0.3 V to AV
DD
+ 0.3 V
REF
IN
to GND −0.3 V to DV
DD
+ 0.3 V
RF
IN
to GND −0.3 V to AV
DD
+ 0.3 V
Operating Temperature Range,
Industrial
−40°C to +125°C
Storage Temperature Range −65°C to +125°C
Maximum Junction Temperature
150°C
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 40 sec
ESD
Charged Device Model 1000 V
Human Body Model
3000 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Thermal impedance (θ
JA
) is specified for a device with the
exposed pad soldered to AGND.
Table 5. Thermal Resistance
Package Type
θ
JA
Unit
24-Lead LFCSP_WQ 30.4 °C/W
ESD CAUTION