Datasheet

Data Sheet ADF4157
Rev. D | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, GND = AGND = DGND = 0 V, V
DD
= AV
DD
= DV
DD
, unless otherwise noted.
Table 3.
Parameter Rating
AV
DD
/DV
DD
to AGND/DGND −0.3 V to +4 V
AV
DD
to DV
DD
−0.3 V to +0.3 V
V
P
to AGND/DGND −0.3 V to +5.8 V
V
P
to AV
DD
/DV
DD
−0.3 V to +5.8 V
Digital I/O Voltage to AGND/DGND −0.3 V to V
DD
+ 0.3 V
Analog I/O Voltage to AGND/DGND −0.3 V to V
DD
+ 0.3 V
REF
IN
, RF
IN
x to AGND/DGND
−0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +125°C
Maximum Junction Temperature 150°C
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θ
JA
Unit
TSSOP 112 °C/W
LFCSP (Paddle Soldered) 30.4 °C/W
ESD CAUTION