Datasheet

Data Sheet ADF4156
Rev. E | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, GND = AGND = DGND = 0 V, V
DD
= AV
DD
= DV
DD
,
unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to GND
−0.3 V to +4 V
V
DD
to V
DD
−0.3 V to +0.3 V
V
P
to GND −0.3 V to +5.8 V
V
P
to V
DD
−0.3 V to +5.8 V
Digital I/O Voltage to GND −0.3 V to V
DD
+ 0.3 V
Analog I/O Voltage to GND −0.3 V to V
DD
+ 0.3 V
REF
IN
, RF
IN
to GND −0.3 V to V
DD
+ 0.3 V
RF
IN
A to RF
IN
B ±600 mV
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +125°C
Maximum Junction Temperature
150°C
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 40 sec
Maximum Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
This device is a high performance RF integrated circuit with an
ESD rating of <2 kV, and it is ESD sensitive. Proper precautions
should be taken for handling and assembly.
THERMAL IMPEDANCE
Table 4. Thermal Impedance
Package Type
θ
JA
Unit
TSSOP 112 °C/W
LFCSP_VQ (Paddle Soldered)
30.4
°C/W
ESD CAUTION