Datasheet
ADF4153 Data Sheet
Rev. F | Page 24 of 24
ORDERING GUIDE
Model
1, 2
Temperature Range
Package Description
Package Option
ADF4153BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4153BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4153BRUZ −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4153BRUZ-RL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4153BRUZ-RL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4153YRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4153YRUZ-RL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4153YRUZ-RL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4153BCPZ −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-1
ADF4153BCPZ-RL −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-1
ADF4153BCPZ-RL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-1
ADF4153YCPZ −40°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-1
ADF4153YCPZ-RL
−40°C to +125°C
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-20-1
ADF4153YCPZ-RL7 −40°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-1
ADF4153WYRUZ-RL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
EV-ADF4153SD1Z
Evaluation Board
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADF4153WYRUZ-RL7 model is available with controlled manufacturing to support the quality and reliability requirements of
automotive applications. Note that this automotive model may have specifications that differ from the commercial models; therefore,
designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for
use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and
to obtain the specific Automotive Reliability reports for this model.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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D03685-0-11/13(F)