Datasheet

Data Sheet ADF41020
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
AV
DD
to GND −0.3 V to +3.9 V
AV
DD
to DV
DD
−0.3 V to +0.3 V
V
P
to GND −0.3 V to +3.9 V
V
P
to AV
DD
−0.3 V to +0.3 V
Digital I/O Voltage, REF
IN
to GND −0.3 V to DV
DD
+ 0.3 V
Analog I/O Voltage to GND −0.3 V to V
P
+ 0.3 V
REF
IN
, RF
IN
to GND
−0.3 V to AV
DD
+ 0.3 V
Operating Temperature Range
Industrial −40°C to +85°C
Storage Temperature Range −65°C to +125°C
Maximum Junction Temperature 150°C
LFCSP θ
JA
Thermal Impedance
1
(Paddle Soldered)
62.82°C/W
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 40 sec
Transistor Count
CMOS 6610
Bipolar 358
ESD (Charged Device Model) 1500 V
ESD (Human Body Model) 4000 V
1
Two signal planes (that is, on the top and bottom surfaces of the board), two
buried planes, and four vias.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION