Datasheet

ADF4007 Data Sheet
Rev. B | Page 14 of 16
OUTLINE DIMENSIONS
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
Figure 15. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADF4007BCPZ −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4007BCPZ-RL −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4007BCPZ-RL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
EVAL-ADF4007EBZ1 Evaluation Board
1
Z = RoHS compliant part.