Datasheet
REV.
–3–
ADF4001
TIMING CHARACTERISTICS
Limit at
T
MIN
to T
MAX
Parameter (B Version) Unit Test Conditions/Comments
t
1
10 ns min DATA to CLOCK Setup Time
t
2
10 ns min DATA to CLOCK Hold Time
t
3
25 ns min CLOCK High Duration
t
4
25 ns min CLOCK Low Duration
t
5
10 ns min CLOCK to LE Setup Time
t
6
20 ns min LE Pulsewidth
Guaranteed by design but not production tested.
Specifications subject to change without notice.
(AV
DD
= DV
DD
= 3 V 10%, 5 V 10%; AV
DD
≤ V
P
≤ 6.0 V
; AGND = DGND = CPGND= 0 V;
R
SET
= 4.7 k; T
A
= T
MIN
to T
MAX
, unless otherwise noted; dBm referred to 50 .)
t
1
t
2
t
3
t
4
t
6
t
5
DB20
(MSB)
DB19
DB2
DB1
(CONTROL BIT C2)
CLOCK
DATA
LE
LE
DB0 (LSB)
(CONTROL BIT C1)
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS
1, 2
(
T
A
= 25°C, unless otherwise noted.)
AV
DD
to GND
3
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +0.3 V
V
P
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
P
to AV
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
Digital I/O Voltage to GND . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Analog I/O Voltage to GND . . . . . . . . . . –0.3 V to V
P
+ 0.3 V
REF
IN
, RF
IN
A, RF
IN
B to GND . . . . . . . –0.3 V to V
DD
+ 0.3 V
RF
IN
A to RF
IN
B . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± mV
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . 150°C
TSSOP θ
JA
Thermal Impedance . . . . . . . . . . . . . . 150.4°C/W
LFCSP θ
JA
Thermal Impedance (Paddle Soldered) . . 122°C/W
LFCSP θ
JA
Thermal Impedance (Paddle Not Soldered) 216°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
This device is a high performance RF integrated circuit with an ESD rating of
<2 kΩ and it is ESD sensitive. Proper precautions should be taken for handling and
assembly.
3
GND = AGND = DGND = 0 V.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADF4001 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
B
600