Datasheet

ADF4001
Rev. B | Page 16
OUTLINE DIMENSIONS
Figure 13. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Figure 14. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADF4001BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4001BRU-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4001BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4001BRUZ −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4001BRUZ-R7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4001BRUZ-RL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4001BCPZ −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4001BCPZ-RL −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADF4001BCPZ-RL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
EV-ADF4001SD1Z Evaluation Board
1
Z = RoHS Compliant Part.
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B