Datasheet

ADE7816 Data Sheet
Rev. A | Page 8 of 48
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 5.
Parameter Rating
VDD to AGND −0.3 V to +3.7 V
VDD to DGND −0.3 V to +3.7 V
Analog Input Voltage to AGND, IAP, IAN,
IBP, IBN, ICP, ICN, IDP, IEP, IFP, IN
−2 V to +2 V
Analog Input Voltage to VP and VN −2 V to +2 V
Reference Input Voltage to AGND
−0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND
−0.3 V to VDD + 0.3 V
Digital Output Voltage to DGND −0.3 V to VDD + 0.3 V
Operating Temperature
Industrial Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Regarding the temperature profile used in soldering RoHS-
compliant parts, Analog Devices, Inc., advises that reflow profiles
should conform to J-STD-20 from JEDEC. Refer to the JEDEC
website for the latest revision.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
40-Lead LFCSP 29.3 1.8 °C/W
ESD CAUTION