Datasheet

ADCLK854
Rev. 0 | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Supply Voltage
V
S
to GND 2 V
Inputs
CLKx and
CLKx
−0.3 V to +2 V
CMOS Inputs −0.3 V to +2 V
Outputs
Maximum Voltage −0.3 V to +2 V
Voltage Reference Voltage (V
REF
) −0.3 to +2 V
Operating Temperature
Ambient Range −40°C to +85°C
Junction 150°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application
printed circuit board (PCB), use the following equation:
T
J
= T
CASE
+ (Ψ
JT
× P
D
)
where:
T
J
is the junction temperature (°C).
T
CASE
is the case temperature (°C) measured by the user at the
top center of the package.
Ψ
JT
is from Table 6.
P
D
is the power dissipation.
Values of
θ
JA
are provided for package comparison and PCB
design considerations.
θ
JA
can be used for a first-order approxi-
mation of T
J
by the equation
T
J
= T
A
+ ( θ
JA
× P
D
)
where
T
A
is the ambient temperature (°C).
Values of
θ
JB
are provided in Table 6 for package comparison
and PCB design considerations.
ESD CAUTION
THERMAL PERFORMANCE
Table 6.
Parameter Symbol Description (Using a 2S2P Test Board) Value
1
Unit
Junction-to-Ambient Thermal Resistance
θ
JA
Still Air Per JEDEC JESD51-2
0.0 m/sec Air Flow 42 °C/W
Moving Air
θ
JMA
Per JEDEC JESD51-6
1.0 m/sec Air Flow 37 °C/W
2.5 m/sec Air Flow 33 °C/W
Junction-to-Board Thermal Resistance
θ
JB
Moving Air Per JEDEC JESD51-8
1.0 m/sec Air Flow 26 °C/W
Junction-to-Case Thermal Resistance
θ
JC
Moving Air Per MIL-STD 883, Method 1012.1
Die-to-Heat Sink 2 °C/W
Junction-to-Top-of-Package Characterization Parameter
Ψ
JT
Still Air Per JEDEC JESD51-2
0 m/sec Air Flow 0.5 °C/W
1
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.