Datasheet

ADCLK854
Rev. 0 | Page 16 of 16
*
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
WITH EXCEPTION TO EXPOSED PAD DIMENSION.
080508-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
OUTLINE DIMENSIONS
6.75
BSC SQ
7.00
BSC SQ
0.30
0.23
0.18
1
48
12
13
37
36
24
25
*
2.90
2.80 SQ
2.70
0.50
0.40
0.30
0.80 MAX
0.65 TYP
5.50 REF
COPLANARITY
0.08
0.20 MIN
EXPOSED
PAD
(BOTTOM VIEW)
0.20 REF
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
12° MAX
TOP VIEW
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
PIN 1
INDICATOR
0.50
BSC
Figure 33. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad
CP-48-6
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADCLK854BCPZ
1
−40°C to +85°C 48-Lead LFCSP_VQ CP-48-6
ADCLK854BCPZ-REEL7
1
−40°C to +85°C 48-Lead LFCSP_VQ CP-48-6
ADCLK854/PCBZ
1
Evaluation Board
1
Z = RoHS Compliant Part.
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D07218-0-4/09(0)