Datasheet

ADCLK846
Rev. B | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Supply Voltage
V
S
to GND 2 V
Inputs
CLK and CLK
−0.3 V to +2 V
CMOS Inputs −0.3 V to +2 V
Outputs
Maximum Voltage −0.3 V to +2 V
Voltage Reference Voltage (V
REF
) −0.3 V to +2 V
Operating Temperature Range
Ambient −40°C to +85°C
Junction 150°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application PCB,
use the following formula:
T
J
= T
CASE
+ (Ψ
JT
× PD)
where:
T
J
is the junction temperature (°C).
T
CASE
is the case temperature (°C) measured by the customer at
top center of the package.
Ψ
JT
is indicated in Table 6.
PD is the power dissipation.
Values of θ
JA
are provided for package comparison and PCB
design considerations. θ
JA
can be used for a first-order
approximation of T
J
by the equation
T
J
= T
A
+ (θ
JA
× PD)
where T
A
is the ambient temperature (°C).
Values of θ
JB
are provided for package comparison and PCB
design considerations.
ESD CAUTION
THERMAL PERFORMANCE
Table 6.
Parameter Symbol Description Value
1
Unit
Junction-to-Ambient Thermal Resistance
θ
JA
Still Air Per JEDEC JESD51-2
0.0 m/sec Airflow 57.0 °C/W
Moving Air
θ
JMA
Per JEDEC JESD51-6
1.0 m/sec Airflow 49.8 °C/W
2.5 m/sec Airflow 44.7 °C/W
Junction-to-Board Thermal Resistance
θ
JB
Moving Air Per JEDEC JESD51-8
1.0 m/sec Airflow 35.2 °C/W
Junction-to-Case Thermal Resistance
θ
JC
Moving Air Per MIL-STD 883, Method 1012.1
Die-to-Heat Sink 2.0 °C/W
Junction-to-Top-of-Package Characterization Parameter Ψ
JT
Still Air Per JEDEC JESD51-2
0 m/sec Airflow 1.0 °C/W
1
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.