Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- GENERAL DESCRIPTION
- TABLE OF CONTENTS
- REVISION HISTORY
- FUNCTIONAL BLOCK DIAGRAM
- SPECIFICATIONS
- ABSOLUTE MAXIMUM RATINGS
- PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
- TYPICAL PERFORMANCE CHARACTERISTICS
- SYSTEM BLOCK DIAGRAM
- THEORY OF OPERATION
- INITIALIZATION
- AUDIO ADCs
- AUDIO DACs
- CONTROL PORTS
- SIGNAL PROCESSING
- RAMS AND REGISTERS
- CONTROL REGISTER MAP
- CONTROL REGISTER DETAILS
- 2048 TO 2055 (0x0800 TO 0x0807)—INTERFACE REGISTERS
- 2056 (0x0808)—GPIO PIN SETTING REGISTER
- 2057 TO 2060 (0x0809 TO 0x080C)—AUXILIARY ADC DATA REGISTERS
- 2064 TO 2068 (0x0810 TO 0x0814)—SAFELOAD DATA REGISTERS
- 2069 TO 2073 (0x0815 TO 0x819)—SAFELOAD ADDRESS REGISTERS
- 2074 TO 2075 (0x081A TO 0x081B)—DATA CAPTURE REGISTERS
- 2076 (0x081C)—DSP CORE CONTROL REGISTER
- 2078 (0x081E)—SERIAL OUTPUT CONTROL REGISTER
- 2079 (0x081F)—SERIAL INPUT CONTROL REGISTER
- 2080 TO 2081 (0x0820 TO 0x0821)—MULTIPURPOSE PIN CONFIGURATION REGISTERS
- 2082 (0x0822)—AUXILIARY ADC AND POWER CONTROL
- 2084 (0x0824)—AUXILIARY ADC ENABLE
- 2086 (0x0826)—OSCILLATOR POWER-DOWN
- 2087 (0x0827)—DAC SETUP
- MULTIPURPOSE PINS
- LAYOUT RECOMMENDATIONS
- TYPICAL APPLICATION SCHEMATICS
- OUTLINE DIMENSIONS
ADAU1701 Data Sheet
Rev. C | Page 10 of 52
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter Rating
DVDD to GND 0 V to 2.2 V
AVDD to GND
0 V to 4.0 V
IOVDD to GND 0 V to 4.0 V
Digital Inputs DGND − 0.3 V, IOVDD + 0.3 V
Maximum Junction Temperature 135°C
Temperature Range
Storage −65°C to +150°C
Operating 0°C to +70°C
Soldering (10 sec) 300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 9. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
48-Lead LQFP 72 19.5 °C/W
ESD CAUTION