Datasheet

ADAU1381
Rev. B | Page 84 of 84
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.65
3.50 SQ
3.35
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
100608-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 73. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-4)
Dimensions shown in millimeters
082808-A
A
B
C
D
E
0.650
0.595
0.540
3.44
3.40
3.36
2.68
2.64
2.60
12
3
45
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.27
0.24
0.21
0.34
0.32
0.30
2.00
REF
BALL A1
IDENTIFIER
SEATING
PLANE
2.50 REF
6
0.50
BALL PITCH
Figure 74. 30-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-30-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADAU1381BCPZ −25°C to +85°C 32-Lead LFCSP_VQ CP-32-4
ADAU1381BCPZ-RL −25°C to +85°C 32-Lead LFCSP_VQ, 13” Tape and Reel CP-32-4
ADAU1381BCPZ-RL7 −25°C to +85°C 32-Lead LFCSP_VQ, 7” Tape and Reel
CP-32-4
ADAU1381BCBZ-RL −25°C to +85°C 30-Ball WLCSP, 13” Tape and Reel
CB-30-2
ADAU1381BCBZ-RL7 −25°C to +85°C 30-Ball WLCSP, 7” Tape and Reel
CB-30-2
EVAL-ADAU1381Z Evaluation Board
1
Z = RoHS Compliant Part.
Purchase of licensed I
2
C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I
2
C Patent
Rights to use these components in an I
2
C system, provided that the system conforms to the I
2
C Standard Specification as defined by Philips.
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D08313-0-1/11(B)