Datasheet

ADAU1381
Rev. B | Page 15 of 84
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
SDA/COUT
ADDR0/CDATA
ADDR1/CLATCH
IOVDD
DAC_SDATA/GPIO0 ADC_SDATA/GPIO1
BCLK/GPIO2
LRCLK/GPIO3
MICBIAS BEEP LMIC/LMICN/MICD1 LMICP RMICP RMIC/RMICN/MICD2 AOUTL AOUTR
PIN 1
INDICATOR
1CM
2PDN
3AGND1
4AVDD1
5DVDDOUT
6DGND
7GPIO
8SCL/CCLK
24 NC
23 AGND2
22 SPP
21 NC
20 SPN
19 AVDD2
18 MCKO
17 MCKI
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
TOP VIEW
(Not to Scale)
ADAU1381
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PAD IS CONNECTED INTERNALLY TO THE
ADAU1381 GROUNDS. FOR INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE SOLDERED TO THE
GROUND PLANE.
08313-007
Figure 7. 32-Lead LFCSP Pin Configuration
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
1
A
B
C
D
E
234
56
AGND2 AOUTL RMICP
LMIC/
LIMICN/
MICD1
MICBIAS CM
SPP AOUTR
RMIC/
RMICN/
MICD2
LMICP BEEP AGND1
SPN
LRCLK/
GPIO3
ADDR0/
CDATA
SCL/
CCLK
PDN AVDD1
AVDD2 MCKO
ADC_
SDATA/
GPIO1
ADDR1/
CLATCH
GPIO DVDDOUT
MCKI
BCLK/
GPIO2
DAC_
SDATA/
GPIO0
IOVDD
SDA/
COUT
DGND
0
8313-008
Figure 8. 30-Ball, 6 × 5 WLCSP Pin Configuration (Bottom View)