Datasheet

ADAU1381
Rev. B | Page 14 of 84
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 8.
Parameter Rating
Power Supply (AVDD1 = AVDD2) −0.3 V to +3.9 V
Input Current (Except Supply Pins) ±20 mA
Analog Input Voltage (Signal Pins) –0.3 V to VDD + 0.3 V
Digital Input Voltage (Signal Pins) −0.3 V to VDD + 0.3 V
Operating Temperature Range (Case) −25°C to +85°C
Storage Temperature Range −65°C to +150°C
In Tabl e 9, θ
JA
is the junction-to-ambient thermal resistance, θ
JB
is
the junction-to-board thermal resistance, θ
JC
is the junction-to-case
thermal resistance, ψ
JB
is the in-use junction-to-top of package ther-
mal resistance, and ψ
JT
is the in-use junction-to-board thermal
resistance. All characteristics are for a 4-layer board.
Table 9. Thermal Resistance
Package Type θ
JA
θ
JB
θ
JC
ψ
JB
ψ
JT
Unit
32-Lead LFCSP 35 19 2.5 18 0.3 °C/W
30-Ball WLCSP 39 7 0.5 °C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION