Datasheet

Data Sheet ADAS1000-3/ADAS1000-4
Rev. A | Page 13 of 76
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter Rating
AVDD to AGND −0.3 V to +6 V
IOVDD to DGND −0.3 V to +6 V
ADCVDD to AGND −0.3 V to +2.5 V
DVDD to DGND
−0.3 V to +2.5 V
REFIN/REFOUT to REFGND −0.3 V to +2.1 V
ECG and Analog Inputs to AGND −0.3 V to AVDD + 0.3 V
Digital Inputs to DGND −0.3 V to IOVDD + 0.3 V
REFIN to ADCVDD ADCVDD + 0.3 V
AGND to DGND −0.3 V to + 0.3 V
REFGND to AGND −0.3 V to + 0.3 V
ECG Input Continuous Current ±10 mA
Storage Temperature Range −65°C to +125°C
Operating Junction Temperature Range −40°C to +85°C
Reflow Profile J-STD-20 (JEDEC)
Junction Temperature 150°C max
ESD
HBM 2500 V
FICDM 1000 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
1
Package Type θ
JA
Unit
56-Lead LFCSP 35 °C/W
64-Lead LQFP 42.5 °C/W
1
Based on JEDEC standard 4-layer (2S2P) high effective thermal conductivity
test board (JESD51-7) and natural convection.
ESD CAUTION