Datasheet

ADA4930-1/ADA4930-2
Rev. A | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the voltage
between the supply pins (V
S
) times the quiescent current (I
S
).
The power dissipated due to the load drive depends upon the
particular application. The power due to load drive is calculated
by multiplying the load current by the associated voltage drop
across the device. RMS voltages and currents must be used in
these calculations.
Table 7.
Parameter Rating
Supply Voltage 5.5 V
Power Dissipation See Figure 4
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +105°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating
only; functional operation of the device at these or any other
conditions above those indicated in the operational section of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more metal directly in contact with the package leads/
exposed pad from metal traces, through holes, ground, and
power planes reduces θ
JA
.
Figure 4 shows the maximum safe power dissipation vs. the
ambient temperature for the ADA4930-1 single 16-lead LFCSP
(98°C/W) and the ADA4930-2 dual 24-lead LFCSP (67°C/W)
on a JEDEC standard 4-layer board.
THERMAL RESISTANCE
θ
JA
is specified for the device (including exposed pad) soldered
to a high thermal conductivity 2s2p circuit board, as described
in EIA/JESD51-7.
3.5
0
–40 11090 100
MAXIMUM POWER DISSIPATION (W)
TEMPERATURE (°C)
0.5
1.0
1.5
2.0
2.5
3.0
–30–20–100 1020304050607080
ADA4930-2
ADA4930-1
09209-004
Table 8. Thermal Resistance
Package Type θ
JA
Unit
16-Lead LFCSP (Exposed Pad) 98 °C/W
24-Lead LFCSP (Exposed Pad) 67 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4930-1/ADA4930-2
packages is limited by the associated rise in junction temperature (T
J
)
on the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the ADA4930-1/ADA4930-2. Exceeding a
junction temperature of 150°C for an extended period can result
in changes in the silicon devices, potentially causing failure.
Figure 4. Maximum Power Dissipation vs. Ambient Temperature,
4-Layer Board
ESD CAUTION