Datasheet

ADA4857-1/ADA4857-2 Data Sheet
Rev. C | Page 20 of 20
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGC.
111908-A
1
0.65
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDIC
A
T
OR
4.10
4.00 SQ
3.90
0.70
0.60
0.50
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
2.25
2.10 SQ
1.95
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 53. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-23)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Ordering Quantity Branding
ADA4857-1YCPZ-R2 –40°C to +125°C 8-Lead LFCSP_VD CP-8-2 250 H15
ADA4857-1YCPZ-RL –40°C to +125°C 8-Lead LFCSP_VD CP-8-2 5,000 H15
ADA4857-1YCPZ-R7 –40°C to +125°C 8-Lead LFCSP_VD CP-8-2 1,500 H15
ADA4857-1YRZ –40°C to +125°C 8-Lead SOIC_N R-8 98
ADA4857-1YRZ-R7 –40°C to +125°C 8-Lead SOIC_N R-8 2,500
ADA4857-1YRZ-RL –40°C to +125°C 8-Lead SOIC_N R-8 1,000
ADA4857-1YR-EBZ
Evaluation Board
ADA4857-1YCP-EBZ Evaluation Board
ADA4857-2YCPZ-R2 –40°C to +125°C 16-Lead LFCSP_WQ CP-16-23 250
ADA4857-2YCPZ-RL –40°C to +125°C 16-Lead LFCSP_WQ CP-16-23 5,000
ADA4857-2YCPZ-R7 –40°C to +125°C 16-Lead LFCSP_WQ CP-16-23 1,500
ADA4857-2YCP-EBZ Evaluation Board
1
Z = RoHS Compliant Part.
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D07040-0-9/13(C)