Datasheet

ADA4853-1/ADA4853-2/ADA4853-3
Rev. F | Page 19 of 20
*
COMPLIANT
TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT
FOR EXPOSED PAD DIMENSION.
1
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*
1.65
1.50 SQ
1.35
16
5
13
8
9
12
4
EXPOSED
PAD
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
07-17-2008-A
Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad (CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature
Range
, 2
Package Description
Ordering
Quantity
Package
Option Branding
ADA4853-1AKSZ-R2 −40°C to +85°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) 250 KS-6 HEC
ADA4853-1AKSZ-R7 −40°C to +85°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) 3000 KS-6 HEC
ADA4853-1AKSZ-RL −40°C to +85°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) 10,000 KS-6 HEC
ADA4853-1AKS-EBZ Evaluation Board 1
ADA4853-2YCPZ-R2 −40°C to +105°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 250 CP-16-3 H0H
ADA4853-2YCPZ-RL −40°C to +105°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 5000 CP-16-3 H0H
ADA4853-2YCPZ-RL7 −40°C to +105°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 1500 CP-16-3 H0H
ADA4853-2YCP-EBZ Evaluation Board 1
ADA4853-3YCPZ-R2 −40°C to +105°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 250 CP-16-3 H0L
ADA4853-3YCPZ-RL −40°C to +105°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 5000 CP-16-3 H0L
ADA4853-3YCPZ-R7 −40°C to +105°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 1500 CP-16-3 H0L
ADA4853-3WYCPZ-R7 −40°C to +105°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 1500 CP-16-3 H2H
ADA4853-3YCP-EBZ Evaluation Board
ADA4853-3YRUZ −40°C to +105°C 14-Lead Thin Shrink Small Outline Package (TSSOP) 96 RU-14
ADA4853-3YRUZ-RL −40°C to +105°C 14-Lead Thin Shrink Small Outline Package (TSSOP) 2500 RU-14
ADA4853-3YRUZ-R7 −40°C to +105°C 14-Lead Thin Shrink Small Outline Package (TSSOP) 1000 RU-14
ADA4853-3YRU-EBZ Evaluation Board 1
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADA4853-3W model is available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.