Datasheet

ADA4850-1/ADA4850-2 Data Sheet
Rev. C | Page 14 of 16
OUTLINE DIMENSIONS
Figure 41. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
Figure 42. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
ADA4850-1YCPZ-R2 −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] CP-8-2 HWB
ADA4850-1YCPZ-RL −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] CP-8-2 HWB
ADA4850-1YCPZ-RL7 −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] CP-8-2 HWB
ADA4850-2YCPZ-R2 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-3 HTB
ADA4850-2YCPZ-RL −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-3 HTB
ADA4850-2YCPZ-RL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-3 HTB
ADA4850-2YCP-EBZ Evaluation Board for 16-Lead Lead Frame Chip Scale
Package
1
Z = RoHS Compliant Part.
1
EXPOSED
PAD
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
04-04-2012-A
*
COMPLIANT
TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
1
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*
1.65
1.50 SQ
1.35
16
5
13
8
9
12
4
EXPOSED
PAD
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
07-17-2008-A