Datasheet

ADA4841-1/ADA4841-2
Rev. E | Page 20 of 20
2.54
2.44
2.34
111809-A
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.80
1.70
1.60
0.203 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
5
)
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION
OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
Figure 55. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-11)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Ordering Quantity Branding
ADA4841-1YRZ −40°C to +125°C 8-Lead SOIC_N R-8 1
ADA4841-1YRZ-R7 −40°C to +125°C 8-Lead SOIC_N R-8 1,000
ADA4841-1YRZ-RL −40°C to +125°C 8-Lead SOIC_N R-8 2,500
ADA4841-1YRJZ-R2 −40°C to +125°C 6-Lead SOT-23 RJ-6 250 HQB
ADA4841-1YRJZ-R7 −40°C to +125°C 6-Lead SOT-23 RJ-6 3,000 HQB
ADA4841-1YRJZ-RL −40°C to +125°C 6-Lead SOT-23 RJ-6 10,000 HQB
ADA4841-2YRMZ −40°C to +125°C 8-Lead MSOP RM-8 1 HRB
ADA4841-2YRMZ-R7 −40°C to +125°C 8-Lead MSOP RM-8 1,000 HRB
ADA4841-2YRMZ-RL −40°C to +125°C 8-Lead MSOP RM-8 3,000 HRB
ADA4841-2YRZ −40°C to +125°C 8-Lead SOIC_N R-8 1
ADA4841-2YRZ-R7 −40°C to +125°C 8-Lead SOIC_N R-8 1,000
ADA4841-2YRZ-RL −40°C to +125°C 8-Lead SOIC_N R-8 2,500
ADA4841-2YCPZ-R2 −40°C to +125°C 8-Lead LFCSP_WD CP-8-11 250 HRB
ADA4841-2YCPZ-R7 −40°C to +125°C 8-Lead LFCSP_WD CP-8-11 1,500 HRB
ADA4841-2YCPZ-RL −40°C to +125°C 8-Lead LFCSP_WD CP-8-11 5,000 HRB
ADA4841-1YR-EBZ −40°C to +125°C Evaluation Board
ADA4841-1YRJ-EBZ −40°C to +125°C Evaluation Board
ADA4841-2YRM-EBZ −40°C to +125°C Evaluation Board
ADA4841-2YR-EBZ −40°C to +125°C Evaluation Board
1
Z = RoHS Compliant Part.
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D05614–0–12/10(E)