Datasheet

Data Sheet ADA4830-1
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage (+VS pin) 6 V
Input Voltage Positive Direction (INN, INP) 22 V
Input Voltage Negative Direction (INN, INP) −10 V
Reference Voltage (VREF pin) +V
S
+ 0.3 V
Power Dissipation See Figure 2
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +125°C
Lead Temperature (Soldering, 10 sec) 260°C
Junction Temperature 150°C
THERMAL RESISTANCE
θ
JA
is specified for the device soldered to a high thermal
conductivity, 4-layer (2s2p) circuit board, as described in
EIA/JESD 51-7.
Table 4.
Package Type θ
JA
Unit
8-Lead LFCSP 116 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4830-1
package is limited by the associated rise in junction temperature
(T
J
) on the die. At approximately 150°C, which is the glass
transition temperature, the plastic changes its properties.
Exceeding a junction temperature of 150°C for an extended
time can result in changes in the silicon devices, potentially
causing failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
S
) times the
quiescent current (I
S
). The power dissipated due to load drive
depends on the particular application. The power due to load
drive is calculated by multiplying the load current by the
associated voltage drop across the device. RMS voltages and
currents must be used in these calculations.
Airflow increases heat dissipation, effectively reducing θ
JA
.
Figure 2 shows the maximum power dissipation in the package
vs. the ambient temperature for the 8-lead LFCSP (116°C/W) on
a JEDEC standard 4-layer board. θ
JA
values are approximate.
Figure 2. Maximum Power Dissipation vs.
Ambient Temperature for a 4-Layer Board
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may ca
use permanent damage to the device. This is a stress
rating only; functional op
eration of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0 10 20 30 40 50 60
70 80 90 100
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMPERATURE (°C)
10020-002